Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma (auth.)This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
類別:
年:
2015
版本:
1
出版商:
Springer US
語言:
english
頁數:
253
ISBN 10:
1461492661
ISBN 13:
9781461492665
文件:
PDF, 15.15 MB
IPFS:
,
english, 2015